Invention Grant
- Patent Title: Headphones
- Patent Title (中): 耳机
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Application No.: US12454885Application Date: 2009-05-26
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Publication No.: US08194910B2Publication Date: 2012-06-05
- Inventor: Hiroshi Uchida , Makoto Ito
- Applicant: Hiroshi Uchida , Makoto Ito
- Applicant Address: JP Kanagawa-Ken
- Assignee: Victor Company of Japan, Ltd.
- Current Assignee: Victor Company of Japan, Ltd.
- Current Assignee Address: JP Kanagawa-Ken
- Agency: Renner, Kenner, Greive, Bobak, Taylor & Weber
- Priority: JP2008-142430 20080530; JP2008-142435 20080530
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
A headphone set has a housing to contain a speaker unit, with a sound emitting surface through which sounds given off by the speaker unit are emitted out, and an ear pad attached to the housing to surround the sound emitting surface. The ear pad has a protruding member and an arc-like member sticking out in opposite directions. The degree of sticking out for the arc-like member is smaller than the degree of sticking out for the protruding member. The protruding member has an inner space interposed between a top section and an opposing bottom section closer than the top section to the sound emitting section. The arc-like member has a top section and an opposing bottom section closer than the top section to the sound emitting surface. The top section of the protruding member is positioned farther than that of the arc-like member from the sound emitting surface.
Public/Granted literature
- US20090296975A1 Headphones Public/Granted day:2009-12-03
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