Invention Grant
- Patent Title: Earphone integrated eartip
- Patent Title (中): 耳机集成耳塞
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Application No.: US11728733Application Date: 2007-03-27
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Publication No.: US08194911B2Publication Date: 2012-06-05
- Inventor: Medford Alan Dyer , Simon Andre Sollberger
- Applicant: Medford Alan Dyer , Simon Andre Sollberger
- Applicant Address: CH
- Assignee: Logitech International, S.A.
- Current Assignee: Logitech International, S.A.
- Current Assignee Address: CH
- Agency: Patent Law Office of David G. Beck
- Main IPC: H04R25/00
- IPC: H04R25/00 ; A61B7/02

Abstract:
An integrated eartip (501) that utilizes a one-piece, rather than a multi-piece, design is provided. The one-piece design is comprised of a first portion that includes at least one, or at least two, sound delivery tubes (513/515) and a second portion that is comprised of a compressible region. The integrated eartip also includes means for releasably attaching the eartip to an earphone in general, and a coupling member (503) in particular, thus allowing the eartip to be replaced as desired. When attached, the sound delivery tube, or tubes, of the integrated eartip are aligned with the acoustic port, or ports, of the earphone/coupling member. The first and second portions of the integrated eartip may exhibit different rigidity and/or compressibility characteristics. The integrated eartip can be fabricated from a single material such as a natural or synthetic elastomer.
Public/Granted literature
- US20080240485A1 Earphone integrated eartip Public/Granted day:2008-10-02
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