Invention Grant
- Patent Title: Methods and systems for high sigma yield estimation using reduced dimensionality
- Patent Title (中): 使用降维的高西格玛产量估算方法和系统
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Application No.: US12646644Application Date: 2009-12-23
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Publication No.: US08195427B2Publication Date: 2012-06-05
- Inventor: Saurabh Tiwary , Hongzhou Liu , Hui Zhang
- Applicant: Saurabh Tiwary , Hongzhou Liu , Hui Zhang
- Applicant Address: US CA San Jose
- Assignee: Cadence Design Systems, Inc.
- Current Assignee: Cadence Design Systems, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: G06F17/18
- IPC: G06F17/18

Abstract:
For an integrated circuit associated with a first plurality of parameters whose values are described by a first probability distribution function, a method for estimating a failure probability includes selecting a first plurality of samples, performing a first test to determine an outcome for each of the first plurality of samples and identifying failed samples. A second plurality of parameters is selected that has fewer parameters than the first plurality of parameters. The failed samples are clustered in the space of the second plurality of parameters using a computer-implemented cluster forming method that, in some cases, returns multiple clusters. The method also includes forming a probability distribution function for each of the clusters, forming a composite probability distribution function that includes a weighted combination of the first probability distribution function and the probability distribution function for each of the clusters. The method further includes selecting a second plurality of samples using the composite probability distribution function and performing a second test to determine an outcome for each of the second plurality of samples. A failure probability can then be computed.
Public/Granted literature
- US20110153272A1 METHODS AND SYSTEMS FOR HIGH SIGMA YIELD ESTIMATION USING REDUCED DIMENSIONALITY Public/Granted day:2011-06-23
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