Invention Grant
- Patent Title: Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power module
- Patent Title (中): 功率元件安装基板，其制造方法，功率元件安装单元，其制造方法以及功率模块
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Application No.: US12303513Application Date: 2007-06-06
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Publication No.: US08198540B2Publication Date: 2012-06-12
- Inventor: Yoshirou Kuromitsu , Hiroya Ishizuka , Hiroshi Miyata , Takeshi Kitahara , Hiroshi Tonomura
- Applicant: Yoshirou Kuromitsu , Hiroya Ishizuka , Hiroshi Miyata , Takeshi Kitahara , Hiroshi Tonomura
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Materials Corporation
- Current Assignee: Mitsubishi Materials Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leason Ellis LLP
- Priority: JP2006-157124 20060606; JP2006-157125 20060606; JP2006-169838 20060620; JP2006-191468 20060712; JP2006-224112 20060821; JP2007-061640 20070312
- International Application: PCT/JP2007/061446 WO 20070606
- International Announcement: WO2007/142261 WO 20071213
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K7/20
Abstract:
A power element mounting substrate including a circuit layer brazed to a surface of a ceramic plate, and a power element soldered to a front surface of the circuit layer, wherein the circuit layer is constituted using an Al alloy with an average purity of more than or equal to 98.0 wt % and less than or equal to 99.9 wt %, Fe concentration of the circuit layer at a side of a surface to be brazed to the ceramic plate is less than 0.1 wt %, and Fe concentration of the circuit layer at a side of the surface opposite to the surface to be brazed is more than or equal to 0.1 wt %.
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