Invention Grant
- Patent Title: Electronic component built-in wiring board and method for radiating heat generated at the same
- Patent Title (中): 电子元器件内置线路板及其散热方法
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Application No.: US12519745Application Date: 2007-12-14
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Publication No.: US08198541B2Publication Date: 2012-06-12
- Inventor: Kenji Sasaoka , Yoshitaka Fukuoka
- Applicant: Kenji Sasaoka , Yoshitaka Fukuoka
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JPP2006-339689 20061218; JPP2007-319474 20071211
- International Application: PCT/JP2007/074152 WO 20071214
- International Announcement: WO2008/075629 WO 20080626
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01K1/00
Abstract:
An electronic component built-in wiring board includes: at least a pair of wiring patterns; an insulating layer disposed between the pair of wiring board; an electronic component embedded in the insulating layer; and a metallic body provided at least on or above a main surface of the electronic component in the insulating layer and thermally contacted with the electronic component.
Public/Granted literature
- US20100025082A1 ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR RADIATING HEAT GENERATED AT THE SAME Public/Granted day:2010-02-04
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