Invention Grant
- Patent Title: Capacitor and manufacturing method thereof
- Patent Title (中): 电容器及其制造方法
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Application No.: US12078648Application Date: 2008-04-02
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Publication No.: US08199456B2Publication Date: 2012-06-12
- Inventor: Sung-Taek Lim , Yul-Kyo Chung , Woon-Chun Kim
- Applicant: Sung-Taek Lim , Yul-Kyo Chung , Woon-Chun Kim
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0037740 20070418
- Main IPC: H01G4/06
- IPC: H01G4/06

Abstract:
A capacitor and a method of manufacturing the capacitor are disclosed. The capacitor may include a board, a polymer layer formed on one side of the board, a circuit pattern selectively formed over the polymer layer, and a titania nanosheet corresponding with the circuit pattern. Embodiments of the invention can provide flatness in the board, and allows the copper of the board to maintain its functionality as an electrode while increasing the adhesion to the titania nanosheet. The titania nanosheet may thus be implemented on a patterned board in a desired shape, number of layers, and thickness.
Public/Granted literature
- US20080259523A1 Capacitor and manufacturing method thereof Public/Granted day:2008-10-23
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