In one implementation, a method is provided for constructing an interface module which includes constructing a board having a signal via through the board, and having at least one ground via extending through the board. The method further includes back drilling the signal via to create a center conductor hole above a remaining portion of the signal via and back drilling a shield opening in the board and at least part way into the at least one ground via such that a height of the center conductor hole is reduced. The method further includes plating the shield opening and the center conductor hole, and back drilling to remove a portion of the plating to electrically isolate the plated shield opening and the plated center conductor hole.