Invention Grant
- Patent Title: Housing for micro-mechanical and micro-optical components used in mobile applications
- Patent Title (中): 用于移动应用的微机械和微光学部件的外壳
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Application No.: US12448911Application Date: 2008-01-17
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Publication No.: US08201452B2Publication Date: 2012-06-19
- Inventor: Marten Oldsen , Ulrich Hofmann
- Applicant: Marten Oldsen , Ulrich Hofmann
- Applicant Address: DE Munich
- Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Current Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Current Assignee Address: DE Munich
- Agency: Jacobson Holman PLLC
- Priority: DE102007002725 20070118
- International Application: PCT/EP2008/000321 WO 20080117
- International Announcement: WO2008/087022 WO 20080724
- Main IPC: G01P15/08
- IPC: G01P15/08
Abstract:
The present invention relates to a housing for one or more micromechanical and/or micro-optic components, wherein the housing exhibits a supporting substrate having at least one micromechanical and/or micro-optic component and at least one cap substrate, which is joined to the supporting substrate. The supporting substrate and the at least one cap substrate form at least one cavity, which at least partially encloses the at least one micromechanical and/or micro-optic component, wherein the side of at least one cap substrate facing the at least one micromechanical and/or micro-optic component exhibits at least one optical window and at least one mechanical stop.Furthermore, the object of the present invention is a method for producing such a housing, wherein the method is particularly usable for encapsulation at the wafer level.
Public/Granted literature
- US20100061073A1 HOUSING FOR MICRO-MECHANICAL AND MICRO-OPTICAL COMPONENTS USED IN MOBILE APPLICATIONS Public/Granted day:2010-03-11
Information query
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