The invention relates to a device for applying an electronic component having terminal faces, to a substrate, also having terminal faces, wherein the component is removed from a feeding device by means of an application device. An application device subsequently positions the component on the substrate in such a manner that the component terminal faces which extend from a contact side of the component up to a component rear side and the substrate terminal faces are in an overlapping position. A direct application of laser energy subsequently contacts the terminal faces to the component terminal faces. The application device has a contact nozzle with a component accommodating area for accommodating the component. The contact nozzle has a vacuum opening coupled to a vacuum duct and an emission opening for applying laser radiation to the component. The emission opening includes two emission windows which are spaced apart from one another by a component contact surface and each of the two emission windows is assigned to one of the terminal faces of the component. The component contact surface is formed by two front surfaces of two support bars which are arranged so as to be located opposite one another and which are embodied in the vacuum duct.