A method for manufacturing a nozzle substrate includes forming a first hollow recess in a first surface of a silicon substrate, forming a liquid-resistant protective film on the first surface of the silicon substrate including an inner wall of the first hollow recess, forming a second hollow recess in a first surface of a glass substrate, bonding the first surfaces of the silicon substrate and the glass substrate by anodic bonding, reducing a thickness of the glass substrate from a second surface until an aperture is formed in a bottom surface of the second hollow recess to form a second nozzle hole disposed on a droplet feed side, and reducing a thickness of the silicon substrate from a second surface until an aperture is formed in a bottom surface of the first hollow recess to form a first nozzle hole disposed on a droplet discharge side.