Invention Grant
- Patent Title: Panelization method and system
- Patent Title (中): 面板化方法和系统
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Application No.: US12019138Application Date: 2008-01-24
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Publication No.: US08205412B2Publication Date: 2012-06-26
- Inventor: Martin Williams , Bill R. Lindley, II , Brian Jacob Meyer
- Applicant: Martin Williams , Bill R. Lindley, II , Brian Jacob Meyer
- Applicant Address: US SC Columbia US OK Oklahoma City
- Assignee: Consolidated Systems, Inc.,W&W Steel, LLC
- Current Assignee: Consolidated Systems, Inc.,W&W Steel, LLC
- Current Assignee Address: US SC Columbia US OK Oklahoma City
- Agency: Nexsen Pruet, LLC
- Agent Michael A. Mann
- Main IPC: E04B1/00
- IPC: E04B1/00

Abstract:
A prefabrication system having a floor component and a frame component. In particular, the floor component includes a deck member, which can be made of deck sections, profiles, or panels. For example, the deck member can be made of continuous panels that cover the desired width and length of the floor component. Alternatively, the deck member can be made of preassembled sections that are combined in juxtaposed relation to form the desired width and length. The frame component includes opposing horizontal support channels that are attached to opposing vertical columns, respectfully.
Public/Granted literature
- US20090188191A1 Panelization Method and System Public/Granted day:2009-07-30
Information query