Invention Grant
- Patent Title: Mounting structure of ultrasonic sensor
- Patent Title (中): 超声波传感器的安装结构
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Application No.: US12565981Application Date: 2009-09-24
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Publication No.: US08205501B2Publication Date: 2012-06-26
- Inventor: Tadashi Nakamura , Takeo Tsuzuki
- Applicant: Tadashi Nakamura , Takeo Tsuzuki
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye PC
- Priority: JP2008-246669 20080925
- Main IPC: G01N29/00
- IPC: G01N29/00

Abstract:
A mobile object includes a wall member to which an ultrasonic sensor is fixed. The wall member has a through hole through which an oscillating face of the ultrasonic sensor is exposed from the wall member. A closing member closes a gap generated between the wall member and the ultrasonic sensor. The closing member connects an edge of the through hole located outside of the wall member and an edge of the oscillating face of the ultrasonic sensor. The closing member has an outer face exposed from the wall member, and the outer face of the closing member has asperities.
Public/Granted literature
- US20100071472A1 MOUNTING STRUCTURE OF ULTRASONIC SENSOR Public/Granted day:2010-03-25
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