Invention Grant
- Patent Title: Composite laminated structure reinforced by inserting pins, a method and a apparatus for making the same and a method for making the apparatus
- Patent Title (中): 通过插入销增强的复合层压结构，其制造方法和装置以及制造该装置的方法
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Application No.: US12532844Application Date: 2008-09-08
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Publication No.: US08205654B2Publication Date: 2012-06-26
- Inventor: Ik Hyeon Choi , In Hee Hwang , Eung Tai Kim , Seok Min Ahn , Chan Hong Yeom , Dae Sung Lee
- Applicant: Ik Hyeon Choi , In Hee Hwang , Eung Tai Kim , Seok Min Ahn , Chan Hong Yeom , Dae Sung Lee
- Applicant Address: KR Daejeon
- Assignee: Korea Aerospace Research Institute
- Current Assignee: Korea Aerospace Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Lowe Hauptman Ham & Berner, LLP
- Priority: KR10-2007-0093965 20070917
- International Application: PCT/KR2008/005293 WO 20080908
- International Announcement: WO2009/038301 WO 20090326
- Main IPC: B29C65/56
- IPC: B29C65/56 ; B29C65/08 ; B32B37/00 ; B32B43/00
Abstract:
A composite laminated structure is reinforced by inserting pins into a device for manufacturing a composite laminated structure. The device has a bottom guide on a composite laminated structure in a pre- or post-cured state. The device has first vertical pins that are inserted into the composite laminated structure. A top guide, on the bottom guide, has guide pins that are movable in a vertical direction at positions corresponding to the first pins.
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