Invention Grant
US08205964B2 Head array unit, image forming apparatus including same, and method for manufacturing the head array unit 有权
头阵列单元,包括其的成像设备以及头阵列单元的制造方法

  • Patent Title: Head array unit, image forming apparatus including same, and method for manufacturing the head array unit
  • Patent Title (中): 头阵列单元,包括其的成像设备以及头阵列单元的制造方法
  • Application No.: US12319513
    Application Date: 2009-01-08
  • Publication No.: US08205964B2
    Publication Date: 2012-06-26
  • Inventor: Akira Saito
  • Applicant: Akira Saito
  • Applicant Address: JP Tokyo
  • Assignee: Ricoh Company, Ltd.
  • Current Assignee: Ricoh Company, Ltd.
  • Current Assignee Address: JP Tokyo
  • Agency: Cooper & Dunham LLP
  • Priority: JP2008-001688 20080108; JP2008-313722 20081209
  • Main IPC: B41J2/14
  • IPC: B41J2/14 B41J2/15 B41J2/155
Head array unit, image forming apparatus including same, and method for manufacturing the head array unit
Abstract:
The present invention provides a head array unit in which a plurality of head members is easily aligned on an alignment member with a simple structure and a method for manufacturing the head array unit, and an image forming apparatus including the head array unit. The head array unit includes a head unit. The head unit includes a head member, a head member retainer, and an alignment member. The head member includes a plurality of nozzles and is configured to eject liquid droplets. The head member retainer, on which the head member is disposed and fixed thereto, includes a reference hole for aligning the head unit relative to the alignment member. The alignment member includes an opening formed at a location associated with the reference hole and relatively larger than the reference hole. The head member may be directly aligned and fixed on the alignment member.
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