Invention Grant
- Patent Title: Electro-optic device packages
- Patent Title (中): 电光器件封装
-
Application No.: US12460477Application Date: 2009-07-20
-
Publication No.: US08206042B2Publication Date: 2012-06-26
- Inventor: Roberto Galeotti , Luigi Gobbi , Mario Bonazzoli
- Applicant: Roberto Galeotti , Luigi Gobbi , Mario Bonazzoli
- Applicant Address: US CA San Jose
- Assignee: Oclaro (North America), Inc.
- Current Assignee: Oclaro (North America), Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson & Sheridan, L.L.P.
- Main IPC: G02B6/42
- IPC: G02B6/42
Abstract:
A package design for electro-optic devices has been developed in which the substrate supporting the electro-optic element serves also as the base of the device housing. The electro-optic element is flip-chip bonded to the substrate. In a preferred embodiment the substrate is a multi-level wiring board.
Public/Granted literature
- US20090324166A1 Electro-optic device packages Public/Granted day:2009-12-31
Information query
