Invention Grant
- Patent Title: Device that can be assembled by coupling
- Patent Title (中): 可通过联轴器组装的装置
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Application No.: US12644964Application Date: 2009-12-22
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Publication No.: US08206053B2Publication Date: 2012-06-26
- Inventor: Richard Bennett , Hyosig Kang , Brian Schmitz
- Applicant: Richard Bennett , Hyosig Kang , Brian Schmitz
- Applicant Address: US FL Fort Lauderdale
- Assignee: MAKO Surgical Corp.
- Current Assignee: MAKO Surgical Corp.
- Current Assignee Address: US FL Fort Lauderdale
- Agency: Foley & Lardner LLP
- Main IPC: B25B11/00
- IPC: B25B11/00

Abstract:
A device can be assembled by a coupling. The device includes first and second body members and positioning structure. The first and second body members are designed to be coupled relative to each other. The positioning structure is designed to provide an interface between the first and second body members, and to position the first and second body members relative to each other via first, second, and third contact areas. The first, second, and third contact areas are each substantially linear and are collectively configured to receive loads, and to limit positioning of the first and second body members relative to each other with regard to five degrees of freedom. A fourth contact area between the first and second body members is designed to limit positioning of the first and second body members relative to each other in a sixth degree of freedom, in a first translational direction.
Public/Granted literature
- US20100166496A1 DEVICE THAT CAN BE ASSEMBLED BY COUPLING Public/Granted day:2010-07-01
Information query