Invention Grant
- Patent Title: Modular articulating cement spacer
- Patent Title (中): 模块化关节水泥垫片
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Application No.: US12390084Application Date: 2009-02-20
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Publication No.: US08206143B2Publication Date: 2012-06-26
- Inventor: H. Gene Hawkins , William Hartman , Kristen Martin , Nathan A. Winslow
- Applicant: H. Gene Hawkins , William Hartman , Kristen Martin , Nathan A. Winslow
- Applicant Address: US IN Warsaw
- Assignee: Biomet Manufacturing Corp.
- Current Assignee: Biomet Manufacturing Corp.
- Current Assignee Address: US IN Warsaw
- Agency: Harness, Dickey
- Main IPC: B28B7/00
- IPC: B28B7/00
Abstract:
The present teachings provide a modular articulating cement spacer mold for forming a temporary implant comprising a mold first portion; a mold second portion; a hinge region connecting the mold first portion and mold second portion; and a self-securing device to removably secure and separate the mold first portion and the mold second portion. Other modular articulating cement spacer molds are also provided.
Public/Granted literature
- US20090175978A1 Modular Articulating Cement Spacer Public/Granted day:2009-07-09
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