Invention Grant
- Patent Title: Modular connector system
- Patent Title (中): 模块化连接器系统
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Application No.: US13017607Application Date: 2011-01-31
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Publication No.: US08206179B2Publication Date: 2012-06-26
- Inventor: David A. Ouellette , John E. Benham
- Applicant: David A. Ouellette , John E. Benham
- Applicant Address: US CT Wallingford
- Assignee: Winchester Electronics Corporation
- Current Assignee: Winchester Electronics Corporation
- Current Assignee Address: US CT Wallingford
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Main IPC: H01R33/00
- IPC: H01R33/00
Abstract:
The present invention provides a modular connector system for, in some embodiments, interconnecting circuit boards. In some embodiments, the modular connector system includes a header assembly for blind mating with an adapter assembly.
Public/Granted literature
- US20110269327A1 MODULAR CONNECTOR SYSTEM Public/Granted day:2011-11-03
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