Invention Grant
- Patent Title: Inner terminal
- Patent Title (中): 内码头
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Application No.: US13003901Application Date: 2009-07-14
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Publication No.: US08206189B2Publication Date: 2012-06-26
- Inventor: Hidenori Kanda
- Applicant: Hidenori Kanda
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-182281 20080714
- International Application: PCT/JP2009/062749 WO 20090714
- International Announcement: WO2010/007992 WO 20100121
- Main IPC: H01R9/24
- IPC: H01R9/24

Abstract:
There is provided an inner terminal capable of providing enhanced reliability of connection in a circuit board. There is also provided an inner terminal capable of providing enhanced high-frequency characteristics by appropriately adjusting impedance. An expanded part (31) for carrier-disconnection is integrally formed with an interconnecting part (27) of an inner terminal (21). The expanded part (31) is formed to be expanded from opposite sides of a horizontal part (29). Also, the expanded part (31) is formed in a plate shape having the same thickness as the horizontal part (29) and also having the front and rear sides which are flush with the horizontal part (29). The expanded part (31) is formed such that edges of the expansion serve as parts at which the inner terminal is disconnected from the carrier when the terminal is produced.
Public/Granted literature
- US20110124249A1 INNER TERMINAL Public/Granted day:2011-05-26
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