Invention Grant
- Patent Title: Method of stacking flexible substrate
- Patent Title (中): 堆叠柔性基板的方法
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Application No.: US13231266Application Date: 2011-09-13
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Publication No.: US08206536B2Publication Date: 2012-06-26
- Inventor: Gi Heon Kim , Yong Hae Kim , Dong Jin Park , Chul Am Kim , Kyung Soo Suh
- Applicant: Gi Heon Kim , Yong Hae Kim , Dong Jin Park , Chul Am Kim , Kyung Soo Suh
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Ladas & Parry LLP
- Priority: KR10-2006-0082746 20060830
- Main IPC: H05K13/04
- IPC: H05K13/04 ; B32B37/10

Abstract:
A method of stacking a flexible substrate is provided. The method includes the steps of: preparing a carrier substrate; stacking an adhesive layer on the carrier substrate; and stacking a flexible substrate having at least one image display device on the adhesive layer using a laminating or pressing method. Thus, the flexible substrate is easily fabricated without modification of conventional mass-production equipment for fabricating a display, and thereby a lightweight, thin, and compact flexible display can be realized.
Public/Granted literature
- US20120000602A1 METHOD OF STACKING FLEXIBLE SUBSTRATE Public/Granted day:2012-01-05
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