Invention Grant
- Patent Title: Reducing agent for low temperature reducing and sintering of copper nanoparticles
- Patent Title (中): 铜纳米粒子的低温还原和烧结还原剂
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Application No.: US12435180Application Date: 2009-05-04
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Publication No.: US08206609B2Publication Date: 2012-06-26
- Inventor: In-Young Kim , Jae-Woo Joung , Young-Ah Song
- Applicant: In-Young Kim , Jae-Woo Joung , Young-Ah Song
- Applicant Address: KR Gyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0087247 20080904
- Main IPC: C09K3/00
- IPC: C09K3/00 ; B22F1/00 ; B22F1/02
Abstract:
The present invention relates to a reducing agent for low temperature reducing and sintering of copper nanoparticles and a method for low temperature sintering using the same. The reducing agent includes formic acid or acetic acid and C1 to C3 alcohol or ether which allows reducing and sintering at a low temperature of less than 250° C. The sintered copper nanoparticles provide excellent electrical properties and are suitable for forming fine wirings patterns.
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