Invention Grant
- Patent Title: Method for consolidating and diffusion-bonding powder metallurgy sputtering target
- Patent Title (中): 粉末冶金溅射靶的固结和扩散粘结方法
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Application No.: US11644816Application Date: 2006-12-22
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Publication No.: US08206646B2Publication Date: 2012-06-26
- Inventor: Chi-Fung Lo , Darryl Draper
- Applicant: Chi-Fung Lo , Darryl Draper
- Applicant Address: US CT Danbury
- Assignee: Praxair Tecnology, Inc.
- Current Assignee: Praxair Tecnology, Inc.
- Current Assignee Address: US CT Danbury
- Agent Nilay S. Dalal; Iurie A. Schwartz
- Main IPC: B22F1/00
- IPC: B22F1/00
Abstract:
Methods for manufacturing sputtering target assemblies and assemblies thereof are provided, particularly targets made of powders. Powders are adhered to a backing plate by use of a vacuum hot press, the powder preferably contacted by non-planar surfaces, and is compressed with at least about 95% density and substantially simultaneously diffusion-bonded to the backing plate.
Public/Granted literature
- US20080149477A1 Method for consolidating and diffusion-bonding powder metallurgy sputtering target Public/Granted day:2008-06-26
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