Invention Grant
- Patent Title: Component measuring apparatus
- Patent Title (中): 元件测量仪器
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Application No.: US12521718Application Date: 2008-01-08
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Publication No.: US08206649B2Publication Date: 2012-06-26
- Inventor: Yoshiro Suzuki , Yasushi Nagasawa , Eiji Arita , Masakazu Ishizu , Yasuhiro Yamamoto
- Applicant: Yoshiro Suzuki , Yasushi Nagasawa , Eiji Arita , Masakazu Ishizu , Yasuhiro Yamamoto
- Applicant Address: JP Shibuya-Ku, Tokyo JP Yao-Shi, Osaka
- Assignee: Terumo Kabushiki Kaisha,Hosiden Corporation
- Current Assignee: Terumo Kabushiki Kaisha,Hosiden Corporation
- Current Assignee Address: JP Shibuya-Ku, Tokyo JP Yao-Shi, Osaka
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2007-010623 20070119
- International Application: PCT/JP2008/050071 WO 20080108
- International Announcement: WO2008/087876 WO 20080724
- Main IPC: G01N15/06
- IPC: G01N15/06 ; G01N33/00 ; G01N33/48
Abstract:
A component measuring apparatus is provided with a case having a cylindrical case main body and a cover arranged to cover the base end opening section of the case main body; a chip mounting section for mounting a chip; a light measuring section for detecting a prescribed component; a printed board whereupon a control section having a function of controlling the operation of the light measuring section is arranged; a liquid crystal display device; a battery arranging section for arranging a battery provided on the cover; an O-ring arranged between the case main body and the light measuring section on the leading end section of the case main body; and an O-ring arranged between the case main body and the cover on the base end opening section of the case main body. Sealing of inside the case is ensured by the O-ring.
Public/Granted literature
- US20100317092A1 COMPONENT MEASURING APPARATUS Public/Granted day:2010-12-16
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