A method for forming a ceramic containing composite structure is proposed comprising the steps of (a) feeding a ceramic component that sublimes and a metallic or semi-conductor material that does not sublime into a thermal spray apparatus, (b) spraying the ceramic component and the metallic or semi-conductor material onto a substrate, whereby the ceramic component and the metallic or semi-conductor material deposit on the surface of the substrate, and (c) keeping the metallic or semi-conductor material on the substrate surface plastic during spraying at least in the region where the metallic or semi-conductor material actually strikes the surface.