Invention Grant
- Patent Title: Method for manufacturing liquid discharge head
- Patent Title (中): 液体排放头的制造方法
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Application No.: US12789640Application Date: 2010-05-28
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Publication No.: US08206998B2Publication Date: 2012-06-26
- Inventor: Masataka Kato , Kazuhiro Hayakawa
- Applicant: Masataka Kato , Kazuhiro Hayakawa
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2009-144149 20090617
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for manufacturing a substrate for a liquid discharge head provided with a silicon substrate and a supply port, including: providing the silicon substrate having an insulating layer on a first surface and an etching mask layer having a plurality of apertures on a second surface which is a rear surface of the first surface, wherein the insulating layer is provided in a region ranging from a position opposing the apertures to a position opposing a portion between the adjacent apertures of the mask layer; and forming holes by etching a silicon part of the silicon substrate so that an etched region reaches a portion of the insulating layer opposing the apertures, wherein the silicon wall provided between the adjacent holes is etched so that the portion in the first surface side thereof can be thinner than the portion in the second surface side thereof.
Public/Granted literature
- US20100323463A1 METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD Public/Granted day:2010-12-23
Information query
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