Invention Grant
- Patent Title: Microball assembly methods, and packages using maskless microball assemblies
- Patent Title (中): 微球组装方法和使用无孔微球组件的包装
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Application No.: US12317587Application Date: 2008-12-23
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Publication No.: US08207057B2Publication Date: 2012-06-26
- Inventor: Erasenthiran Poonjolai , Lakshmi Supriva
- Applicant: Erasenthiran Poonjolai , Lakshmi Supriva
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method of forming a microball grid array includes adhering a microball precursor material to a transfer medium under conditions to reflect a selective charge pattern. The method includes transferring the microball precursor material from the transfer medium across a gap and to an integrated circuit substrate under conditions to reflect the selective charge pattern. The method includes achieving the microball grid array without the aid of a mask.
Public/Granted literature
- US20100155923A1 Microball assembly methods, and packages using maskless microball assemblies Public/Granted day:2010-06-24
Information query
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