Invention Grant
- Patent Title: Adhesive resin composition and laminate
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Application No.: US12065049Application Date: 2006-09-01
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Publication No.: US08207072B2Publication Date: 2012-06-26
- Inventor: Chikako Ikeda
- Applicant: Chikako Ikeda
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Chemical Corporation
- Current Assignee: Mitsubishi Chemical Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-255193 20050902; JP2006-161184 20060609
- International Application: PCT/JP2006/317377 WO 20060901
- International Announcement: WO2007/026893 WO 20070308
- Main IPC: B32B27/32
- IPC: B32B27/32 ; B32B27/12

Abstract:
An adhesive resin composition excellent in adhesiveness and heat resistance thereof, film-forming properties, and film quality and a laminate having an adhesive resin layer made of this adhesive resin composition are provided.The Composition is an adhesive resin composition comprising 10-99.5% by weight resin ingredient (A), 0.5-30% by weight another resin ingredient (unsaturated-carboxylic-acid-modified polypropylene), and 0-89.5% by weight still another resin ingredient (olefin resin).Resin ingredient (A): a product of successive propylene polymerization comprising 10-60% by weight (propylene homopolymer) component and 40-90% by weight (propylene/ethylene copolymer) component. The contents of room-temperature-xylene solubles derived from (a2), room-temperature-xylene insolubles derived from (a2), and room-temperature-xylene solubles derived from the same are 1-20% by weight, lower than 20% by weight, and 10-60% by weight, respectively, based on resin ingredient (A). The room-temperature-xylene solubles derived from (a2) have a content of α-olefins excluding propylene of 20% by weight or higher.
Public/Granted literature
- US08242036B2 Adhesive resin composition and laminate Public/Granted day:2012-08-14
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