Invention Grant
- Patent Title: Reinforcing structures for thin-film photovoltaic device substrates, and associated methods
- Patent Title (中): 薄膜光伏器件基板的增强结构及相关方法
-
Application No.: US11737119Application Date: 2007-04-18
-
Publication No.: US08207442B2Publication Date: 2012-06-26
- Inventor: Lawrence M. Woods , Joseph H. Armstrong , Rosine M. Ribelin , Thomas Duncan Barnard , Yukinari Harimoto , Hidekatsu Hatanaka , Maki Itoh , Dimitris Elias Katsoulis , Michitaka Suto , Bizhong Zhu , Nicole R. Anderson , Herschel Henry Reese
- Applicant: Lawrence M. Woods , Joseph H. Armstrong , Rosine M. Ribelin , Thomas Duncan Barnard , Yukinari Harimoto , Hidekatsu Hatanaka , Maki Itoh , Dimitris Elias Katsoulis , Michitaka Suto , Bizhong Zhu , Nicole R. Anderson , Herschel Henry Reese
- Applicant Address: US CO Littleton
- Assignee: ITN Energy Systems, Inc.
- Current Assignee: ITN Energy Systems, Inc.
- Current Assignee Address: US CO Littleton
- Agency: Lathrop & Gage LLP
- Main IPC: H01L31/00
- IPC: H01L31/00
Abstract:
In an embodiment, one reinforced substrate for use in a photovoltaic device includes a polymer base material and a reinforcing structure bonded with the base material. The reinforced substrate presents a surface in a condition that is made-ready for deposition of thin film layers of the photovoltaic device. A thin film photovoltaic device includes the reinforced substrate, a back contact layer formed on the surface of the reinforced substrate, and a solar absorber layer formed on the back contact layer. A plurality of thin film photovoltaic devices may be formed on a common reinforced substrate. A process of producing a reinforced substrate includes combining a fluid base material and a fiber reinforcing structure to form an impregnated fiber reinforcement. The impregnated fiber reinforcement is cured to form the reinforced substrate, and the reinforced substrate is annealed.
Public/Granted literature
- US20080115827A1 Reinforcing Structures For Thin-Film Photovoltaic Device Substrates, And Associated Methods Public/Granted day:2008-05-22
Information query
IPC分类:
