Invention Grant
- Patent Title: Non-metallic, integrated sensor-interconnect device, manufacturing process, and related applications
- Patent Title (中): 非金属,集成传感器互连器件,制造工艺及相关应用
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Application No.: US12402717Application Date: 2009-03-12
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Publication No.: US08207446B2Publication Date: 2012-06-26
- Inventor: Joseph A. Swift , Stanley J. Wallace , Roger Lee Bullock
- Applicant: Joseph A. Swift , Stanley J. Wallace , Roger Lee Bullock
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: MH2 Technology Law Group LLP
- Main IPC: H01B3/00
- IPC: H01B3/00

Abstract:
Exemplary embodiments provide materials, devices and arrays of integrated sensor assembly, as well as methods for forming and using such devices and arrays in sensing systems. In one embodiment, the integrated sensor assembly can include an interconnecting member and at least one sensor member connected with the interconnecting member at any location thereof. Each of the sensor member and the interconnecting member can include a core element and a polymer. The core element for the sensor member and the core element for the interconnecting member can be electrically interconnected. Various embodiments can also include a connector member connected to the interconnecting member for transmitting sensing signals from or to the sensor member.
Public/Granted literature
- US20100230132A1 NON-METALLIC, INTEGRATED SENSOR-INTERCONNECT DEVICE, MANUFACTURING PROCESS, AND RELATED APPLICATIONS Public/Granted day:2010-09-16
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