Invention Grant
- Patent Title: Ground-plane slotted type signal transmission circuit board
- Patent Title (中): 地平面开槽式信号传输电路板
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Application No.: US12284677Application Date: 2008-09-24
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Publication No.: US08207451B2Publication Date: 2012-06-26
- Inventor: Hsin-Chia Lu , Tsung-Yi Chou
- Applicant: Hsin-Chia Lu , Tsung-Yi Chou
- Applicant Address: TW Taipei
- Assignee: National Taiwan University
- Current Assignee: National Taiwan University
- Current Assignee Address: TW Taipei
- Agency: Edwards Wildman Palmer LLP
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW97113563A 20080415
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A ground-plane slotted type signal transmission circuit board is proposed, which is designed for use with a high-speed digital signal processing system for providing a low-loss signal transmission function. The proposed circuit board structure is characterized by the formation of a slotted structure (i.e., elongated cutaway portion) in the ground plane at the beneath of each signal line. Since the slotted structure is a void portion, the electric field of a gigahertz signal being transmitting through the overlaying signal line would be unable to induce electric currents in the void portion of the ground plane. This feature allows the prevention of a leakage current that would otherwise flow from the signal line to the ground plane, and therefore can help prevent unnecessary power loss of the transmitted signal.
Public/Granted literature
- US20090255720A1 Ground-plane slotted type signal transmission circuit board Public/Granted day:2009-10-15
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