Invention Grant
- Patent Title: Light emitting diode package and method for manufacturing same
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US12728260Application Date: 2010-03-21
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Publication No.: US08207549B2Publication Date: 2012-06-26
- Inventor: Sei-Ping Louh
- Applicant: Sei-Ping Louh
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910306472 20090902
- Main IPC: H01L33/48
- IPC: H01L33/48
Abstract:
An exemplary light emitting diode package includes a housing, and a light emitting unit received in the housing. The light emitting unit includes a first carbon nanotube layer, a plurality of spaced light emitting chips, and a second carbon nanotube layer. The light emitting chips are formed on the first carbon nanotube layer. The second carbon nanotube layer covers the light emitting chips.
Public/Granted literature
- US20110049536A1 LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2011-03-03
Information query
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