Invention Grant
US08207562B2 Image sensor and method of fabricating the same including a gate insulation layer, a gate electrode, a photodiode and a floating diffusion region 有权
图像传感器及其制造方法,包括栅极绝缘层,栅电极,光电二极管和浮动扩散区域

  • Patent Title: Image sensor and method of fabricating the same including a gate insulation layer, a gate electrode, a photodiode and a floating diffusion region
  • Patent Title (中): 图像传感器及其制造方法,包括栅极绝缘层,栅电极,光电二极管和浮动扩散区域
  • Application No.: US12581407
    Application Date: 2009-10-19
  • Publication No.: US08207562B2
    Publication Date: 2012-06-26
  • Inventor: Ji-Hoon Hong
  • Applicant: Ji-Hoon Hong
  • Applicant Address: KR Seoul
  • Assignee: Dongbu Hitek Co., Ltd.
  • Current Assignee: Dongbu Hitek Co., Ltd.
  • Current Assignee Address: KR Seoul
  • Agency: Sherr & Vaughn, PLLC
  • Priority: KR10-2006-0135632 20061227
  • Main IPC: H01L31/062
  • IPC: H01L31/062 H01L31/113 H01L31/06 H01L31/00
Image sensor and method of fabricating the same including a gate insulation layer, a gate electrode, a photodiode and a floating diffusion region
Abstract:
An image sensor can include a gate insulation layer, a gate electrode, a photodiode, and a floating diffusion region. The gate insulation layer can be formed on and/or over a semiconductor substrate for a transfer transistor. The gate insulation layer includes a first gate insulation layer having a central opening and a second gate insulation layer formed on and/or over an uppermost surface of the first gate insulation layer including the opening. The gate electrode can be formed on and/or over the gate insulation layer. The photodiode can be formed in the semiconductor substrate at one side of the gate electrode so as to generate an optical charge. The floating diffusion region can be formed in the semiconductor at the other side of the gate electrode opposite to the photodiode. The floating diffusion region can be electrically connected to the photodiode through a channel so as to store the optical charge generated from the photodiode.
Public/Granted literature
Information query
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L31/00 对红外辐射、光、较短波长的电磁辐射,或微粒辐射敏感的,并且专门适用于把这样的辐射能转换为电能的,或者专门适用于通过这样的辐射进行电能控制的半导体器件;专门适用于制造或处理这些半导体器件或其部件的方法或设备;其零部件(H01L51/42优先;由形成在一共用衬底内或其上的多个固态组件,而不是辐射敏感元件与一个或多个电光源的结合所组成的器件入H01L27/00)
H01L31/04 .用作光伏〔PV〕转换器件(制造中其测试入H01L21/66;制造之后其测试入H02S50/10)
H01L31/06 ..以至少有一个电位跃变势垒或表面势垒为特征的
H01L31/062 ...只是金属—绝缘体—半导体型势垒的
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