Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12698458Application Date: 2010-02-02
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Publication No.: US08207574B2Publication Date: 2012-06-26
- Inventor: Nobuo Kaneko
- Applicant: Nobuo Kaneko
- Applicant Address: JP Niiza-shi
- Assignee: Sanken Electric Co., Ltd.
- Current Assignee: Sanken Electric Co., Ltd.
- Current Assignee Address: JP Niiza-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-083944 20090331
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A object is to provide a semiconductor device having normally-off characteristics and capable of easily suppressing field concentration below a side surface of a concave portion. A device includes a nitride-based semiconductor layer having a concave portion formed in a part of one principal surface, a side surface of the concave portion being slanted; a first electrode provided on the principal surface; a second electrode on an opposite side to the first electrode across the concave portion, and provided on the principal surface; an insulating layer formed on both sides of the concave portion in the principal surface; and a control electrode provided on the concave portion and at least a part of the wall surface of the insulating layer on the concave portion-side. A tilt angle of the wall surface of the insulating layer is greater than a tilt angle of the side surface of the concave portion.
Public/Granted literature
- US20100244018A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-09-30
Information query
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