Invention Grant
- Patent Title: Semiconductor devices including dual gate structures
- Patent Title (中): 包括双栅极结构的半导体器件
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Application No.: US12348737Application Date: 2009-01-05
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Publication No.: US08207582B2Publication Date: 2012-06-26
- Inventor: Jaydeb Goswami
- Applicant: Jaydeb Goswami
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
Semiconductor devices including dual gate structures and methods of forming such semiconductor devices are disclosed. For example, semiconductor devices are disclosed that include a first gate stack that may include a first conductive gate structure formed from a first material, and a second gate stack that may include a dielectric structure formed from an oxide of the first material. For another example, methods including forming a high-K dielectric material layer over a semiconductor substrate, forming a first conductive material layer over the high-K dielectric material layer, oxidizing a portion of the first conductive material layer to convert the portion of the first conductive material layer to a dielectric material layer, and forming a second conductive material layer over both the conductive material layer and the dielectric material layer are also disclosed.
Public/Granted literature
- US20100171178A1 SEMICONDUCTOR DEVICES INCLUDING DUAL GATE STRUCTURES AND METHODS OF FORMING SUCH SEMICONDUCTOR DEVICES Public/Granted day:2010-07-08
Information query
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