Invention Grant
- Patent Title: Integrated circuit package system with encapsulating features
- Patent Title (中): 集成电路封装系统具有封装特性
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Application No.: US11694921Application Date: 2007-03-30
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Publication No.: US08207600B2Publication Date: 2012-06-26
- Inventor: Henry Descalzo Bathan , Jeffrey D. Punzalan , Abelardo Hadap Advincula , Jose Alvin Caparas
- Applicant: Henry Descalzo Bathan , Jeffrey D. Punzalan , Abelardo Hadap Advincula , Jose Alvin Caparas
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley Chang
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
An integrated circuit package system is provided including forming a lead frame includes forming a mold gate, providing a first surface, and providing a second surface opposite the first surface; and forming angled gate sides facing each other in the mold gate between the first surface and the second surface.
Public/Granted literature
- US20080237816A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATING FEATURES Public/Granted day:2008-10-02
Information query
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