Invention Grant
- Patent Title: Interconnections for fine pitch semiconductor devices and manufacturing method thereof
- Patent Title (中): 细间距半导体器件的互连及其制造方法
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Application No.: US11905482Application Date: 2007-10-01
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Publication No.: US08207608B2Publication Date: 2012-06-26
- Inventor: Hwee-Seng Jimmy Chew , Chee Kian Ong
- Applicant: Hwee-Seng Jimmy Chew , Chee Kian Ong
- Applicant Address: SG Singapore
- Assignee: Advanpack Solutions Pte Ltd.
- Current Assignee: Advanpack Solutions Pte Ltd.
- Current Assignee Address: SG Singapore
- Agency: Rabin & Berdo, P.C.
- Priority: TW95137971 20061014
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor device and a manufacturing method thereof are provided. The semiconductor device has an active surface. The semiconductor device includes at least a connecting element and at least a bump. The connecting element is disposed on the activate surface and has a minimum dimension smaller than 100 microns. The bump is disposed on the connecting element and is electrically connected to the active surface by the connecting element. The bump includes a pillar part disposed on the connecting element and a top part disposed on the top of the pillar part. The pillar part has a first dimension and a second dimension both parallel to the active surface. The first dimension is longer than 1.2 times the second dimension. The top part is composed of solder and will melt under a pre-determined temperature. The pillar part will not melt under the pre-determined temperature.
Public/Granted literature
- US20080088013A1 Chip and manufacturing method thereof Public/Granted day:2008-04-17
Information query
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