Invention Grant
US08207620B2 Flip-chip semiconductor package and chip carrier for preventing corner delamination
有权
倒装芯片半导体封装和芯片载体，用于防止角分层
- Patent Title: Flip-chip semiconductor package and chip carrier for preventing corner delamination
- Patent Title (中): 倒装芯片半导体封装和芯片载体，用于防止角分层
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Application No.: US11880467Application Date: 2007-07-20
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Publication No.: US08207620B2Publication Date: 2012-06-26
- Inventor: Yuan-Lin Tzeng , Nai-Hao Kao , Jeng-Yuan Lai , Yu-Po Wang , Cheng-Hsu Hsiao
- Applicant: Yuan-Lin Tzeng , Nai-Hao Kao , Jeng-Yuan Lai , Yu-Po Wang , Cheng-Hsu Hsiao
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Edwards Wildman Palmer LLP
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW95126475A 20060720
- Main IPC: H01L23/29
- IPC: H01L23/29
Abstract:
The present invention discloses a flip-chip semiconductor package and a chip carrier thereof. The chip carrier includes a groove formed around a chip-mounting area. The groove may be formed along a periphery of the chip-mounting area or at corners thereof. The groove is filled with a filler of low Young's modulus so as to absorb and eliminate thermal stress, thereby preventing delamination between an underfill and a flip chip mounted on the chip-mounting area.
Public/Granted literature
- US20080017983A1 Flip-chip semiconductor package and chip carrier thereof Public/Granted day:2008-01-24
Information query
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