There is provided a testing apparatus including a plurality of test units, a storage that is shared by the plurality of test units, where the storage stores therein wafers under test to be tested by the plurality of test units, a transport mechanism that transports the wafers under test between the storage and each of the plurality of test units, a mainframe that specifies a test procedure for each of the plurality of test units, a power source that is shared by the plurality of test units, where the power source supplies power to each of the plurality of test units, and a pressure source that is shared by the plurality of test units, where the pressure source supplies a pressure to each of the plurality of test units. Here, each of the plurality of test units includes a test module that transmits and receives a test signal to/from a plurality of circuits formed on a wafer under test, a connector that connects together transmission paths of the test signal between the test module and the wafer under test, a holding member that brings the wafer under test into contact with the connector when supplied with the pressure, and a housing that houses therein the holding member and the connector, where the wafer under test is to be tested within the housing.