Invention Grant
US08208017B2 Imaging device, product package, and semiconductor integrated circuit
有权
成像装置,产品包装和半导体集成电路
- Patent Title: Imaging device, product package, and semiconductor integrated circuit
- Patent Title (中): 成像装置,产品包装和半导体集成电路
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Application No.: US10596819Application Date: 2004-12-24
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Publication No.: US08208017B2Publication Date: 2012-06-26
- Inventor: Mitsuaki Oshima
- Applicant: Mitsuaki Oshima
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Snell & Wilmer L.L.P.
- Priority: JP2003-435934 20031226; JP2004-366913 20041217
- International Application: PCT/JP2004/019403 WO 20041224
- International Announcement: WO2005/064921 WO 20050714
- Main IPC: H04N7/18
- IPC: H04N7/18 ; G03B17/00

Abstract:
The image pickup apparatus (1) of the present invention includes: a shaking motion detecting section (101a and 101b) for detecting a shaking motion of the image pickup apparatus (1) and for outputting a shaking motion detection signal indicating the shaking motion of the image pickup apparatus (1); an image forming section (2, 2a, and 2b) for forming an optical image by focusing light incident to the image pickup apparatus (1); an image pickup section (5) for converting the optical image formed by the image forming section (2, 2a, and 2b) into electric video information; and a locus calculating section (91) for obtaining locus information indicating a locus of the shaking motion of the image pickup apparatus (1) based on at least the shaking motion detection signal output from the shaking motion detecting section (101a and 101b).
Public/Granted literature
- US20070291114A1 Imaging Device, Product Package, and Semiconductor Integrated Circuit Public/Granted day:2007-12-20
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