Plural LEDs 21 are mounted on a top surface 20a of a circuit board 20, and a circuit pattern 22 for supplying power to the LEDs 21 and metallic film islands 23 for heat radiation are provided on a back surface 20b. Further, lens 30 is provided on the top surface 20a of the circuit board 20, that is, a surface where the circuit pattern 22 and the metallic film islands 23 are not provided, so as to cover each of the LEDs 21. The lens 30 is cured after dripping a liquid resin including a silicone resin containing silica. Therefore, distortion of the cover members formed on the substrate by dripping the liquid resin is suppressed.