Invention Grant
- Patent Title: External thermal solution for a mobile computing device
- Patent Title (中): 用于移动计算设备的外部热解决方案
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Application No.: US12384726Application Date: 2009-04-08
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Publication No.: US08208250B2Publication Date: 2012-06-26
- Inventor: Rajiv K. Mongia
- Applicant: Rajiv K. Mongia
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Derek J. Reynolds
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00 ; A47B77/08 ; F28F7/00 ; H01L23/34
Abstract:
A method, system, and apparatus are disclosed. In one embodiment method includes causing a cooling medium to flow through a hollow cable. The cable couples an external cooling station to a heat exchanging unit. The heat exchanging unit is located within a mobile computing device. The method then transfers heat from within the mobile computing device to the cooling medium at the heat exchanging unit. Then the cooling medium contained the transferred heat is expelled out of the mobile computing device.
Public/Granted literature
- US20100259886A1 External thermal solution for a mobile computing device Public/Granted day:2010-10-14
Information query
