Invention Grant
- Patent Title: Protocol circuit layer
- Patent Title (中): 协议电路层
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Application No.: US12278144Application Date: 2007-02-01
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Publication No.: US08208466B2Publication Date: 2012-06-26
- Inventor: Riley Eller , Frank Laub , Jeremy Bruestle , Mark L. Tucker
- Applicant: Riley Eller , Frank Laub , Jeremy Bruestle , Mark L. Tucker
- Applicant Address: US WA Seattle
- Assignee: CoCo Communications Corp.
- Current Assignee: CoCo Communications Corp.
- Current Assignee Address: US WA Seattle
- Agency: Lowe Graham Jones PLLC
- International Application: PCT/US2007/061488 WO 20070201
- International Announcement: WO2007/090197 WO 20070809
- Main IPC: H04L12/28
- IPC: H04L12/28
Abstract:
A protocol circuit layer is described. The protocol circuit layer may employ a routing layer to determine optimal routes when establishing a circuit. The circuit layer may employ a link layer to send data packets over links to other network nodes. A naming layer may employ circuits to establish a distributed database of associations between network node addresses and their network locations.
Public/Granted literature
- US20100008362A1 PROTOCOL CIRCUIT LAYER Public/Granted day:2010-01-14
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