Invention Grant
US08208673B2 Miniaturized acoustic boom structure for reducing microphone wind noise and ESD susceptibility
有权
用于降低麦克风风噪声和ESD敏感性的小型化声臂结构
- Patent Title: Miniaturized acoustic boom structure for reducing microphone wind noise and ESD susceptibility
- Patent Title (中): 用于降低麦克风风噪声和ESD敏感性的小型化声臂结构
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Application No.: US12114583Application Date: 2008-05-02
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Publication No.: US08208673B2Publication Date: 2012-06-26
- Inventor: John Steven Graham , Osman Kemal Isvan
- Applicant: John Steven Graham , Osman Kemal Isvan
- Applicant Address: US CA Santa Cruz
- Assignee: Plantronics, Inc
- Current Assignee: Plantronics, Inc
- Current Assignee Address: US CA Santa Cruz
- Agency: Chuang Intellectual Property Law
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/02 ; H04M9/00 ; H04M1/00 ; F01N13/00

Abstract:
A miniaturized acoustic boom structure includes a microphone boom housing having a wind screen and a microphone pod configured to hold a microphone. The microphone pod has an outer surface secured to an inner surface of the microphone boom housing, an interior having one or more surfaces configured to form an acoustic seal around at least a portion of the periphery of the microphone, and first and second pod port openings. The first and second pod port openings provide sound wave access to opposing sides of a diaphragm of the microphone, and are shaped and spaced away from the first and second microphone ports of the microphone so that an acoustic path length between the first and second pod port openings is greater than an acoustic path length between the first and second microphone ports.
Public/Granted literature
- US20090274332A1 Miniaturized Acoustic Boom Structure For Reducing Microphone Wind Noise and ESD Susceptibility Public/Granted day:2009-11-05
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