Invention Grant
- Patent Title: Method and system for inspecting a diced wafer
- Patent Title (中): 用于检查切片晶片的方法和系统
-
Application No.: US12350243Application Date: 2009-01-08
-
Publication No.: US08208713B2Publication Date: 2012-06-26
- Inventor: Yuri Postolov , Menachem Regensburger
- Applicant: Yuri Postolov , Menachem Regensburger
- Applicant Address: IL Migdal Haemek
- Assignee: Camtek Ltd.
- Current Assignee: Camtek Ltd.
- Current Assignee Address: IL Migdal Haemek
- Agency: Reches Patents
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A method for inspecting a diced object that comprises multiple dies, the method includes: acquiring multiple images of multiple portions of the diced object, starting from a first portion that comprises an alignment area and continuing through adjacent portions of the diced object; assigning a die index to each die of the multiple dies of the diced object, starting from a die of the first portion and continuing through adjacent portions of the diced object; associating between dies of the diced object and a dies of a reference object in response to the assigned indexes and locations of the dies of the diced object; wherein the reference object is not diced; and comparing between a die of the diced object and another die while taking into account an association between the die of the diced object and a reference object die.
Public/Granted literature
- US20090116726A1 Method and system for inspecting a diced wafer Public/Granted day:2009-05-07
Information query