Invention Grant
- Patent Title: Implantable medical device conductor insulation and process for forming
- Patent Title (中): 可植入医疗器械导体绝缘和成型工艺
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Application No.: US12683561Application Date: 2010-01-07
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Publication No.: US08209032B2Publication Date: 2012-06-26
- Inventor: Michael J Ebert , John L Sommer , Richard D Ries , Jordan D Honeck , Pedro A Meregotte , Kenneth R Brennen
- Applicant: Michael J Ebert , John L Sommer , Richard D Ries , Jordan D Honeck , Pedro A Meregotte , Kenneth R Brennen
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Carol F. Barry
- Main IPC: A61N1/00
- IPC: A61N1/00
Abstract:
An elongate medical electrical lead conductor includes a layer of hydrolytically stable polyimide formed thereover.
Public/Granted literature
- US20100114282A1 IMPLANTABLE MEDICAL DEVICE CONDUCTOR INSULATION AND PROCESS FOR FORMING Public/Granted day:2010-05-06
Information query
