Invention Grant
- Patent Title: Wafer inspection data handling and defect review tool
- Patent Title (中): 晶圆检查数据处理和缺陷检查工具
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Application No.: US13040794Application Date: 2011-03-04
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Publication No.: US08209135B2Publication Date: 2012-06-26
- Inventor: Tomohiro Funakoshi , Junko Konishi , Yuko Kariya , Noritsugu Takahashi , Fumiaki Endo
- Applicant: Tomohiro Funakoshi , Junko Konishi , Yuko Kariya , Noritsugu Takahashi , Fumiaki Endo
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2005-326123 20051110
- Main IPC: H04N7/18
- IPC: H04N7/18
Abstract:
A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.
Public/Granted literature
- US20110211060A1 WAFER INSPECTION DATA HANDLING AND DEFECT REVIEW TOOL Public/Granted day:2011-09-01
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