Invention Grant
US08209460B2 Dual memory chip package operable to access heterogeneous memory chips
有权
双存储器芯片封装可操作以访问异构存储器芯片
- Patent Title: Dual memory chip package operable to access heterogeneous memory chips
- Patent Title (中): 双存储器芯片封装可操作以访问异构存储器芯片
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Application No.: US10976384Application Date: 2004-10-29
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Publication No.: US08209460B2Publication Date: 2012-06-26
- Inventor: Jin-Yub Lee
- Applicant: Jin-Yub Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2003-0098803 20031229
- Main IPC: G06F12/00
- IPC: G06F12/00 ; G06F13/00 ; G06F13/28 ; G11C5/06 ; G11C11/34 ; G11C16/04

Abstract:
A dual-chip package is disclosed which includes at least two memory chips each of which may contain buffer and flash memories having different address systems from each other. Each memory chip may include a register for storing first and second flag signals each indicative of selections of corresponding memory chips, a comparator circuit for comparing the first and second flag signals in the register with a reference signal to generate a flash access signal and a buffer access signal, and a controller for controlling the buffer memory and the flash memory in response to the flash access signal and the buffer access signal.
Public/Granted literature
- US20050141318A1 Dual chip package Public/Granted day:2005-06-30
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