Invention Grant
US08209649B2 Methods and systems for computer aided design of 3D integrated circuits 有权
3D集成电路计算机辅助设计方法与系统

  • Patent Title: Methods and systems for computer aided design of 3D integrated circuits
  • Patent Title (中): 3D集成电路计算机辅助设计方法与系统
  • Application No.: US12537500
    Application Date: 2009-08-07
  • Publication No.: US08209649B2
    Publication Date: 2012-06-26
  • Inventor: Lisa G. McIlrath
  • Applicant: Lisa G. McIlrath
  • Applicant Address: US MA Bedford
  • Assignee: R3 Logic, Inc
  • Current Assignee: R3 Logic, Inc
  • Current Assignee Address: US MA Bedford
  • Agency: Seyfarth Shaw LLP
  • Agent Brian L. Michaelis
  • Main IPC: G06F17/50
  • IPC: G06F17/50
Methods and systems for computer aided design of 3D integrated circuits
Abstract:
Methods and systems for generating and verifying circuit layouts from computer-aided design tools for vertically integrated, three-dimensional integrated circuits are disclosed. In one instance, a 3-D technology file of these teachings is obtained by providing an identifier for two or more circuit levels, providing for each one of the two or more circuit levels an identifier for a 2-D technology file corresponding to each of the one or more circuit levels and providing a file structure including the two or more circuit levels and each identifier, corresponding to each one of the one or more circuit levels, for the 2-D technology file corresponding to each one of the two or more circuit levels. Other embodiments are disclosed.
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