Invention Grant
- Patent Title: Method of fabricating the electronic device
- Patent Title (中): 制造电子装置的方法
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Application No.: US12394995Application Date: 2009-02-27
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Publication No.: US08209829B2Publication Date: 2012-07-03
- Inventor: Takeo Takahashi , Xiaoyu Mi , Satoshi Ueda
- Applicant: Takeo Takahashi , Xiaoyu Mi , Satoshi Ueda
- Applicant Address: JP Tokyo JP Kawasaki
- Assignee: Taiyo Yuden Co., Ltd.,Fujitsu Limited
- Current Assignee: Taiyo Yuden Co., Ltd.,Fujitsu Limited
- Current Assignee Address: JP Tokyo JP Kawasaki
- Agency: Arent Fox LLP
- Priority: JP2008-048798 20080228
- Main IPC: H01G7/00
- IPC: H01G7/00
Abstract:
A method of fabricating an electronic device includes selectively forming a glass layer on a ceramic substrate by printing, baking the glass layer, and forming a capacitor on the glass layer, the capacitor including metal electrodes and a dielectric layer interposed between the metal electrodes.
Public/Granted literature
- US20090219670A1 ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2009-09-03
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