Invention Grant
- Patent Title: Rework soldering jig
- Patent Title (中): 返工焊接夹具
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Application No.: US12906765Application Date: 2010-10-18
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Publication No.: US08209853B2Publication Date: 2012-07-03
- Inventor: Ching Shun Chen
- Applicant: Ching Shun Chen
- Applicant Address: TW Taipei
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW Taipei
- Agency: Morris Manning & Martin LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW99117836A 20100602
- Main IPC: H05K13/00
- IPC: H05K13/00
Abstract:
A rework soldering jig is used for heating a surface mounted slot. The rework soldering jig includes a body and an assembly frame. The assembly frame is detachably disposed on the body. The body and the assembly frame together wrap the surface mounted slot. Since the rework soldering jig has the detachable assembly frame, a size thereof can be adjusted according to different forms of slots.
Public/Granted literature
- US20110296677A1 REWORK SOLDERING JIG Public/Granted day:2011-12-08
Information query
